Samsung было in the news a lot lately for its upcoming foldable and wearable devices, but the company’s next flagship, the S series, hasn’t been left out of the spotlight.
A recent post from Ice Universe’s regular leaker on the Chinese social media platform Weibo contains some interesting details about what to expect from the S25 Ultra.
It claims that the next flagship will have a new design. Ice Universe suggests that the S25 Ultra will be thinner than its predecessor, with a thickness of 8.4 mm compared to 8.6 mm for the S24 Ultra.
Although this size difference is minor, the post also shows that Samsung is not compromising on camera capabilities for thinness. Although details are still under wraps, rumors suggest that the S25 Ultra will feature an improved 200-megapixel primary camera, as well as 50-megapixel ultra-wide-angle, 50-megapixel 3x telephoto, and 50-megapixel 5x telephoto lenses.
In a separate post on X (formerly Twitter), the insider revealed another detail about the design. According to Ice Universe, the S25 Ultra “will no longer press your palm” and will be “really rounded!”
This means that the S25 Ultra will move away from the sharp corners that Samsung introduced in the S24 Ultra and will likely adopt a curved design similar to the S23 Ultra and S22 Ultra. The source seems quite confident about this change, claiming that there is a “100%” chance that this will happen.
While this seems like a credible leak, another rumor earlier this week suggested that Samsung could introduce MediaTek chips in the S25 series for the first time. This would bring the number of SoCs for Samsung’s S-series flagships to three, including Qualcomm, Samsung’s own Exynos chips, and MediaTek.
However, the same source who
Samsung
Qualcomm
ice